All articles by "Vertyanov D.V."
Using Three-Dimensional Modeling in the HyperLynx Advanced Solvers Environment to Analyze the Integrity of Signals in Circuits of a Three-Dimensional with Backside Metallization Microassembly
| Authors: Batin S.A., Vertyanov D.V., Evstafyev S.S. | Published: 13.04.2025 |
| Published in issue: #1(150)/2025 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: microassembly, backside metallization, three-dimensional, signal integrity, electromag-netic compatibility, S-parameters | |
Development and Study of a Modular Block Housing Based on the RS-533 High-Strength Powder using the Additive Selective Laser Melting Technology
| Authors: Volkov S.V., Vertyanov D.V., Timoshenkov S.P. | Published: 19.06.2024 |
| Published in issue: #2(147)/2024 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: additive technologies, additive manufacture, additive electronics, 3D printing, selective laser melting, aluminum alloys, heterogeneous integration | |
Thermomechanical Stresses Simulation in the Structure Redistribution Layers of a Microsystem Design with the Embedded Crystals
| Authors: Kochergin M.D., Solovyov Il.A., Vertyanov D.V., Timoshenkov S.P. | Published: 15.01.2024 |
| Published in issue: #4(145)/2023 | |
| DOI: 10.18698/0236-3933-2023-4-24-42 | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: internal assembly, redistribution layers, thermomechanical stresses, linear expansion temperature coefficient | |