Search by keyword: "signal integrity"
Design of Multi-Level System in Package with Metalized Vias in a Mold Compound
| Authors: Semenov S.P., Batin S.A., Vertyanov D.V., Zhumagali R.N., Kochergin M.D., Timoshenkov S.P. | Published: 12.08.2026 |
| Published in issue: #2(155)/2026 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Electronic Component Base of Micro- and Nanoelectronics, Quantum Devices | |
| Keywords: system in package, three-dimensional packaging, vias, mold compound, chip package substrate, signal integrity, S-parameters, impedance | |
Using Three-Dimensional Modeling in the HyperLynx Advanced Solvers Environment to Analyze the Integrity of Signals in Circuits of a Three-Dimensional with Backside Metallization Microassembly
| Authors: Batin S.A., Vertyanov D.V., Evstafyev S.S. | Published: 13.04.2025 |
| Published in issue: #1(150)/2025 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: microassembly, backside metallization, three-dimensional, signal integrity, electromag-netic compatibility, S-parameters | |