Design of Multi-Level System in Package with Metalized Vias in a Mold Compound

Abstract

The article considers the prospects of using metallized and galvanic copper-filled vias in a mold compound or a polymer material used to seal integrated circuits during two-dimensional or three-dimensional packaging. The main objective of the study is to investigate the effect of the proposed structure on the signal integrity for various functional levels of a system in a package. The technology of manufacturing systems in a package with mold compound allows increasing the packing density of elements, ensures reliable connection of levels, microcircuits both in a package and unpackaged design and significantly reduces the size of the final product, ensuring high performance and reliability of electronic devices. The article presents formulas for calculating the electrical parameters of vias made in the mold compound of a system in a package. A comparative analysis of the results obtained using mathematical formulas with the result of simulation carried out by the finite element method in a three-dimensional modeling environment is carried out. The possibilities of modeling the propagation of electromagnetic waves for analyzing the integrity of signals and electromagnetic compatibility in the design of multi-crystal assemblies and systems in a case using vias made in a thermosetting mold compound intended for sealing microcircuits are considered. Based on the analysis of the obtained modeling results, matched structures of vias in the mold compound were determined, which have optimal relationships between overall dimensions, technological feasibility of production and introduced losses in signal integrity

The work was supported by the Ministry of Science and Higher Education of the Russian Federation (project no. FSMR-2025-0005)

Please cite this article in English as:

Semenov S.P., Batin S.A., Vertyanov D.V., et al. Design of multi-level system in pack-age with metalized vias in a mold compound. Herald of the Bauman Moscow State Technical University, Series Instrument Engineering, 2026, no. 2 (155), pp. 19--40 (in Russ.). EDN: EECTTB

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