Using Three-Dimensional Modeling in the HyperLynx Advanced Solvers Environment to Analyze the Integrity of Signals in Circuits of a Three-Dimensional with Backside Metallization Microassembly

Abstract

The paper discusses the possibilities of modeling the propagation of electromagnetic waves to analyze signal integrity and electromagnetic compatibility for three-dimensional end-switched microassemblies in three- and two-dimensional media. According to the results of the analysis, the advantages of using three-dimensional modeling environments are determined, which make it possible to study the electrical characteristics of various products that include complex-shaped conductors, such as end-switched microassemblies, products with the installation of crystals by the wirebonding method, multi-chip modules, etc. The propagation of electric and magnetic fields in a microassembly with end-mounted switching, which performs the function of linear frequency modulation as part of the digital part of the radar, is analyzed. As a result of the simulation, for a frequency of 500 MHz, the most interference-generating circuits are found, causing unwanted voltage surges in neighboring signal conductors. To determine methods for improving signal quality in end-switched microassembly, the simplified model analyzes the S-parameters for conductors at the ends of the product located at a distance equal to one, two, three and four conductor widths. The signal quality is improved (by about 33 %) by increasing the gap between the conductors from one to two and from two to three conductor widths. With an increase in the gap from three to four conductor widths, the improvement in signal quality was 15 %

The work was carried out with the financial support of the Ministry of Science and Higher Education of the Russian Federation within the framework of the state project (project no. FSMR-2022-002).

Please cite this article in English as:

Batin S.A., Vertyanov D.V., Evstafyev S.S. Using three-dimensional modeling in the HyperLynx Advanced Solvers environment to analyze the integrity of signals in circuits of a three-dimensional with backside metallization microassembly. Herald of the Bauman Moscow State Technical University, Series Instrument Engineering, 2025, no. 1 (150), pp. 4--17 (in Russ.). EDN: YZDDDS

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