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Using Three-Dimensional Modeling in the HyperLynx Advanced Solvers Environment to Analyze the Integrity of Signals in Circuits of a Three-Dimensional with Backside Metallization Microassembly
| Authors: Batin S.A., Vertyanov D.V., Evstafyev S.S. | Published: 13.04.2025 |
| Published in issue: #1(150)/2025 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: microassembly, backside metallization, three-dimensional, signal integrity, electromag-netic compatibility, S-parameters | |