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Thermomechanical Stresses Simulation in the Structure Redistribution Layers of a Microsystem Design with the Embedded Crystals
| Authors: Kochergin M.D., Solovyov Il.A., Vertyanov D.V., Timoshenkov S.P. | Published: 15.01.2024 |
| Published in issue: #4(145)/2023 | |
| DOI: 10.18698/0236-3933-2023-4-24-42 | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: internal assembly, redistribution layers, thermomechanical stresses, linear expansion temperature coefficient | |