All articles by "Timoshenkov S.P."
Design of Multi-Level System in Package with Metalized Vias in a Mold Compound
| Authors: Semenov S.P., Batin S.A., Vertyanov D.V., Zhumagali R.N., Kochergin M.D., Timoshenkov S.P. | Published: 12.08.2026 |
| Published in issue: #2(155)/2026 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Electronic Component Base of Micro- and Nanoelectronics, Quantum Devices | |
| Keywords: system in package, three-dimensional packaging, vias, mold compound, chip package substrate, signal integrity, S-parameters, impedance | |
Development and Study of a Modular Block Housing Based on the RS-533 High-Strength Powder using the Additive Selective Laser Melting Technology
| Authors: Volkov S.V., Vertyanov D.V., Timoshenkov S.P. | Published: 19.06.2024 |
| Published in issue: #2(147)/2024 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: additive technologies, additive manufacture, additive electronics, 3D printing, selective laser melting, aluminum alloys, heterogeneous integration | |
Thermomechanical Stresses Simulation in the Structure Redistribution Layers of a Microsystem Design with the Embedded Crystals
| Authors: Kochergin M.D., Solovyov Il.A., Vertyanov D.V., Timoshenkov S.P. | Published: 15.01.2024 |
| Published in issue: #4(145)/2023 | |
| DOI: 10.18698/0236-3933-2023-4-24-42 | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Design and Instrument Engineering Technology and Electronic Equipment | |
| Keywords: internal assembly, redistribution layers, thermomechanical stresses, linear expansion temperature coefficient | |