All articles by "Semenov S.P."
Design of Multi-Level System in Package with Metalized Vias in a Mold Compound
| Authors: Semenov S.P., Batin S.A., Vertyanov D.V., Zhumagali R.N., Kochergin M.D., Timoshenkov S.P. | Published: 12.08.2026 |
| Published in issue: #2(155)/2026 | |
| DOI: | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Electronic Component Base of Micro- and Nanoelectronics, Quantum Devices | |
| Keywords: system in package, three-dimensional packaging, vias, mold compound, chip package substrate, signal integrity, S-parameters, impedance | |