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High-Density Layout of Conductive Pattern for Multilayer Wiring Board
| Authors: Mironova Zh.A., Shakhnov V.A., Gridnev V.N. | Published: 10.12.2014 |
| Published in issue: #6(99)/2014 | |
| DOI: | |
| Category: Design and technology | |
| Keywords: multilayer wiring board, density layout of conductive pattern, design wiring board for a BGA, decrease the number of layers boards, plated through holes, filling blind holes | |