High-Density Layout of Conductive Pattern for Multilayer Wiring Board

This article describes the method of manufacturing high-density layout of conductive pattern for a BGA with a large pin count (up to 1681 pcs.) which would be disposed as a matrix with a pitch from 1,5 mm to 0,5 mm. Integration of surface-mount components location with filling blind hole to subsurface layers of board within 5th accuracy class (in Russian category) increases to 2,4 times the density layout of wiring contact pads. The number of layers PCB with plated through holes and filling blind holes represented as a function of the pin count for a BGA components in the case of location with conductors (1 to 3) in a narrow place. We demonstrated a reduction the number of layers PCB (to 44%) needed for tracing through the use of filling blind holes for board produced within 5th accuracy class. The possibility of using the BGA components at a pitch below 0,8 mm as a part assembly of commutation board within 5th accuracy class.

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