Infrared thermography methods of assessing temperature effect on reliability of electronic equipment
| Authors: Semencov S.G., Gridnev V.N., Sergeeva N.A. | Published: 19.02.2016 |
| Published in issue: #1(106)/2016 | |
| DOI: 10.18698/0236-3933-2016-1-3-14 | |
| Category: Instrument Engineering, Metrology, Information-Measuring Instruments and Systems | Chapter: Instrumentation and Methods to Control Environment, Substances, Materials, and Products | |
| Keywords: thermal imaging, infrared thermography, latent defects, parametric failures | |
The paper discusses the methods of estimating temperature regimes and their impact on electronic devices reliability. The analysis of component failures is conducted. They occur due to violation of the thermal regime. Possible causes of their occurrences are presented. We demonstrated how the methods of non-contact thermal imaging diagnostics are used to detect latent defects that result in violations of the thermal regime as well as in parametric or sudden failures in electronic equipment components.
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