Investigation of Structure of Soldered Joints Obtained with Application of Leadless Solde
| Authors: Feng Lei | Published: 02.03.2014 |
| Published in issue: #2(75)/2009 | |
| DOI: | |
| Category: Design and technology | |
| Keywords: | |
The microstructure and mechanical properties of soldered joints obtained with application of leadless solder (Sn(99.3)Cu(0.7)) are investigated.
